![]() ![]() Same as above, except hardened top surface allows handling without distortion in cases where this feature is required. Same general purpose silicone compound as above plus additional hardening of the top surface to facilitate handling and installation during complex assemblies. All such surface voids, when properly filled with a conformable, thermally conductive GR series gap filler pad, will in most cases exhibit the continuous characteristics of a solid metal of the same dimensions. Complete physical contact is necessary to minimize the resistance to heat flow for the best thermally conductive path. Thermal impedance of semiconductor mounted to substrate with gap filler pad is eliminated yielding higher temperature gradient.Īs shown above, even the most highly polished mating surfaces do not make reliable contact surfaces. Thermal impedance of semiconductor mounted to substrate is appreciably increased at junction of porous surfaces. Four series, each with a different construction, accommodate most every demanding application. ![]() ![]() In areas where space between surfaces is uneven or varies and where surface textures are a concern regarding efficient thermal transfer, the supple consistency of the pads is excellent for filling air gaps and uneven surfaces.
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